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Flexible Circuit Board Prototype

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unit price: negotiable
min amount:
amount:
period for delivery: Consignment Deadline Days
area: Beijing
Expiry date : Long Effective
last update: 2018-08-16 19:50
view count: 168
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Product details

    A Flex PCB or FPCB is a patterned arrangement of printed circuitry and components that utilizes flexible based material with or without flexible coverlay. These flexible electronic assemblies may be fabricated using the same components used for rigid printed circuit boards, but allowing the board to conform to a desired shape (flex) during its application

Technical  Specification

Layers:

1~10 (Flex Pcb)  And 2~8 (Rigid Flex)


Min Panel Size:

5mm X 8mm


Max Panel Size:

250 X 520mm


Min Finished Board Thickness:

0.05mm (1 Sided Inclusive Copper)


Max Finished Board Thickness:

0.3mm (2 Sided Inclusive Copper)


Finished Board Thickness Tolerance:

±0.02~0.03mm


Material:

Kapton, Polyimide, PET


Base Copper Thickness (RA Or ED):

1/3 Oz, 1/2 Oz, 1oz, 2oz


Base PI Thickness:

0.5mil, 0.7mil, 0.8mil, 1mil, 2mil


Stiffner:

Polyimide, PET, FR4, SUS


Min Finished Hole Diameter:

Φ 0.15mm


Max Finished Hole Diameter:

Φ 6.30mm


Finished Hole Diameter Tolerance (PTH):

±2 Mil ( ±0.050mm)


Finished Hole Diameter Tolerance (NPTH):

±1 Mil ( ±0.025mm)


Min Width/Spacing (1/3oz):

0.05mm/0.06mm


Min Width/Spacing (1/2oz):

0.06mm/0.07mm


Min Width/Spacing (1oz):

Single Layer: 0.07mm/0.08mm


Double Layer: 0.08mm/0.09mm


Aspect Ratio

6:01

8:01

Base Copper

1/3Oz--2Oz

3 Oz For Prototype

Size Tolerance

Conductor Width:±10%

W ≤0.5mm

Hole Size: ±0.05mm

H ≤1.5mm

Hole Registration: ±0.050mm


Outline Tolerance:±0.075mm

L ≤50mm

Surface Treatment

ENIG: 0.025um - 3um


OSP:


Immersion Tin: 0.04-1.5um


Dielectric Strength

AC500V


Solder Float

288℃/10s

IPC Standard

Peeling Strength

1.0kgf/Cm

IPC-TM-650

Flammability

94V-O

UL

Our Service  

PCB Assembly Services: 
SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

Conformal coating

Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
 applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. 
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material

http://www.jiaspeed.com/

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