A Flex PCB or FPCB is a patterned arrangement of printed circuitry and components that utilizes flexible based material with or without flexible coverlay. These flexible electronic assemblies may be fabricated using the same components used for rigid printed circuit boards, but allowing the board to conform to a desired shape (flex) during its application
Technical Specification | ||
Layers: |
1~10 (Flex Pcb) And 2~8 (Rigid Flex) |
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Min Panel Size: |
5mm X 8mm |
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Max Panel Size: |
250 X 520mm |
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Min Finished Board Thickness: |
0.05mm (1 Sided Inclusive Copper) |
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Max Finished Board Thickness: |
0.3mm (2 Sided Inclusive Copper) |
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Finished Board Thickness Tolerance: |
±0.02~0.03mm |
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Material: |
Kapton, Polyimide, PET |
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Base Copper Thickness (RA Or ED): |
1/3 Oz, 1/2 Oz, 1oz, 2oz |
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Base PI Thickness: |
0.5mil, 0.7mil, 0.8mil, 1mil, 2mil |
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Stiffner: |
Polyimide, PET, FR4, SUS |
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Min Finished Hole Diameter: |
Φ 0.15mm |
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Max Finished Hole Diameter: |
Φ 6.30mm |
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Finished Hole Diameter Tolerance (PTH): |
±2 Mil ( ±0.050mm) |
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Finished Hole Diameter Tolerance (NPTH): |
±1 Mil ( ±0.025mm) |
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Min Width/Spacing (1/3oz): |
0.05mm/0.06mm |
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Min Width/Spacing (1/2oz): |
0.06mm/0.07mm |
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Min Width/Spacing (1oz): |
Single Layer: 0.07mm/0.08mm |
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Double Layer: 0.08mm/0.09mm |
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Aspect Ratio |
6:01 |
8:01 |
Base Copper |
1/3Oz--2Oz |
3 Oz For Prototype |
Size Tolerance |
Conductor Width:±10% |
W ≤0.5mm |
Hole Size: ±0.05mm |
H ≤1.5mm |
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Hole Registration: ±0.050mm |
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Outline Tolerance:±0.075mm |
L ≤50mm |
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Surface Treatment |
ENIG: 0.025um - 3um |
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OSP: |
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Immersion Tin: 0.04-1.5um |
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Dielectric Strength |
AC500V |
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Solder Float |
288℃/10s |
IPC Standard |
Peeling Strength |
1.0kgf/Cm |
IPC-TM-650 |
Flammability |
94V-O |
UL |
Our Service
PCB Assembly Services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
http://www.jiaspeed.com/